| NO. | PART NAME | PART P/N | PCS | ||||||||||||||||||||||||||
| 2-1. | Terminal | XHB-2Y white | 1PCS | ||||||||||||||||||||||||||
| 2-2. | NTC Thermistor | R25=15KΩ±5% B25/50=4150K±3% | 1PCS | ||||||||||||||||||||||||||
| 2-3. | Casing | Φ3.0 600V black heat shrink tubing | 1PCS | ||||||||||||||||||||||||||
| 2-4. | COATING RESIN | G-108L:GU-01L：G-008X Black | / | ||||||||||||||||||||||||||
| 2-5. | Temperature Measurement shell | 3.7X6.0X28 nickel plated terminal (DES1612004 A-0) | 1PCS | ||||||||||||||||||||||||||
| NO. | Parameter | Symbol | Test Conditions | Min. | Nor. | Max. | Unit. | ||
| 3-1. | Resistance At 25℃ | R25 | Ta=25℃±0.05℃ PT≦0.02mW |
9.9 | 10 | 10.1 | KΩ | ||
| 3-2. | B Constant | B25/85 | 1779.707*Ln(R25/R85） | 3400.7 | 3435.0 | 3469.4 | K | ||
| 3-3. | Thermal Dissipation Constant (In air) |
δ | Ta=25℃ | ----- | Approx3 | ----- | mW/℃ | ||
| 3-4. | Thermal Time Constant (In Water) |
τ | 25℃→85℃ T1=25+(85-25)*63.2%=62.92℃ |
----- | Approx12 | ----- | Sec | ||
| 3-5. | Insulation test | ----- | DC 500V 3 sec | Min : 100 MΩ | |||||
| Parameter | Specification | Unit | ||||||
| Operation Temperature Range | -40 ----- +105 | ℃ | ||||||
| Item | Test Conditions | Variable | |||||||||||
| Temp. cycle test |
|
No appearance damage ∣△R25/ R25∣≤5% ∣△B/ B∣≤2% |
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| Low temp.test | -40±2℃ X 1000±24 HRS | No appearance damage ∣△R25/ R25∣≤5% ∣△B/ B∣≤2% |
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| High temp.test | +105±2℃ X 1000±24 HRS | No appearance damage ∣△R25/ R25∣≤5% ∣△B/ B∣≤2% |
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| Humidity test | 40±2 ℃ 95 % RH X 500±12 HRS | No appearance damage ∣△R25/ R25∣≤5% ∣△B/ B∣≤2% |
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| Install and use | ||||||||||
| 1. Use this product within the specified temperature range. |
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| 2. Higher temperature may cause deterioration of the characteristics or the material quality of this product. | ||||||||||
| 3. Do not melt the solder in resin head, when you solder this product. If you melt the solder in resin head, | ||||||||||
| it has possibility that the break of wire, short and insulation damage. | ||||||||||
| 4. Do not touch the resin head directly by solder iron. It may cause the melt of solder in resin head. | ||||||||||
| 5. At least away from resin head 10mm above when lead dividing. | ||||||||||
| 6. In case you cut the lead wire of this product less than 10mm from resin head, | ||||||||||
| the heat of melted solder at lead wire edge is propagated easily to the resin head along the lead wire. | ||||||||||
| 7. Radius of lead bending should be more than 1mm when lead bending. | ||||||||||
| Holding element by side lead wire is recommended when lead wire is bent or cut. | ||||||||||
| 8. Do not apply an excessive force to the lead. Otherwise, it may cause junction between lead and element to break or crack. | ||||||||||
| 9. The ceramic element of this product is fragile, and care must be taken not to load an excessive press-force | ||||||||||
| or not to give a shock at handling. Such forces may cause cracking or chipping. | ||||||||||
| 10. If you mold by resin this product, please evaluate the quality of this product before you use it. | ||||||||||
| Warehouse Storage Conditions of Products | ||||||||||
| To keep solderability of product from declining, the following storage condition is recommended. | ||||||||||
| 1. Storage condition: | ||||||||||
| Temperature -10℃ to +40℃ | ||||||||||
| Humidity less than 75%RH (not dewing condition) | ||||||||||
| 2. Storage term: | ||||||||||
| Use this product within 1 year after delivery by first-in and first-out stocking system. | ||||||||||
| 3. Handling after unpacking: | ||||||||||
| After unpacking, reseal product promptly or store it in a sealed container with a drying agent. | ||||||||||
| 4. Storage place: | ||||||||||
| Do not store this product in corrosive gas (Sulfuric acid gas, Chlorine gas, etc.) or in direct sunlight. | ||||||||||
| Warn and note item | ||||||||||
| This product is designed for application in an ordinary environment (normal room temperature, humidity and atmospheric pressure). | ||||||||||
| Do not use under the following conditions because all of these factors can deteriorate the product characteristics or cause failures and burn-out. | ||||||||||
| 1. Corrosive gas or deoxidizing gas (Chlorine gas, Hydrogen sulfide gas, Ammonia gas, Sulfuric acid gas, Nitric oxide gas, etc.) | ||||||||||
| 2. Volatile or flammable gas | ||||||||||
| 3. Dusty conditions | ||||||||||
| 4. Under vacuum, or under high or low pressure | ||||||||||
| 5. Wet or humid locations; soak in the liquid or wash with liquid | ||||||||||
| 6. Places with salt water, oils, chemical liquids or organic solvents and do not use directly with quick-drying glue. | ||||||||||
| 7. Strong vibrations | ||||||||||
| 8. Other places where similar hazardous conditions exist | ||||||||||
| 9. Be sure to provide an appropriate fail-safe function on your product to prevent secondary damages | ||||||||||
| that may be caused by the abnormal function or the failure of our product. | ||||||||||
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